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MXPLAD18KP30A

在庫數 0

小計金額 $0.00000

仕様 よくある質問
  • Package / Case:PLAD-2
  • Mounting Type:Surface Mount
  • Supplier Device Package:PLAD
  • RoHS:N
  • Breakdown Voltage / V:33.3 V
  • Pppm - Peak Pulse Power Dissipation:18 kW
  • Vesd - Voltage ESD Contact:-
  • Vesd - Voltage ESD Air Gap:-
  • Ipp - Peak Pulse Current:372 A
  • Minimum Operating Temperature:- 55 C
  • Maximum Operating Temperature:+ 150 C
  • Pd - Power Dissipation:2.5 W
  • Factory Pack QuantityFactory Pack Quantity:1
  • Package:Bulk
  • Base Product Number:PLAD18
  • Mfr:Microchip Technology
  • Product Status:Active
  • Rohs Code:No
  • Manufacturer Part Number:MXPLAD18KP30A
  • Part Life Cycle Code:Active
  • Ihs Manufacturer:MICROSEMI CORP
  • Risk Rank:5.88
  • Series:MX
  • Packaging:Bulk
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Pbfree Code:No
  • ECCN Code:EAR99
  • Type:Zener
  • Applications:General Purpose
  • HTS Code:8541.10.00.50
  • Reach Compliance Code:compliant
  • Termination Style:SMD/SMT
  • Operating Supply Voltage:30 V
  • Working Voltage:30 V
  • Polarity:Unidirectional
  • Number of Channels:1 Channel
  • Power Line Protection:No
  • Voltage - Breakdown (Min):33.3V
  • Power - Peak Pulse:18000W (18kW)
  • Current - Peak Pulse (10/1000μs):372A
  • Voltage - Clamping (Max) @ Ipp:48.4V
  • Clamping Voltage:48.4 V
  • Voltage - Reverse Standoff (Typ):30V
  • Unidirectional Channels:1
  • Capacitance @ Frequency:-
  • Vf - Forward Voltage:2 V

在庫數 0

小計金額 $0.00000