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在庫數 0

小計金額 $0.00000

仕様 よくある質問
  • Surface Mount:NO
  • Mounting Type:Surface Mount
  • Package / Case:16-UFBGA, WLCSP
  • Supplier Device Package:16-WLCSP (1.41x1.41)
  • Diode Element Material:SILICON
  • Number of Terminals:4
  • Manufacturer Part Number:BR1002-G
  • Rohs Code:Yes
  • Part Life Cycle Code:Active
  • Ihs Manufacturer:COMCHIP TECHNOLOGY CO LTD
  • Package Description:R-XUFM-D4
  • Risk Rank:5.61
  • Number of Elements:4
  • Operating Temperature-Max:150 °C
  • Operating Temperature-Min:-55 °C
  • Package Body Material:UNSPECIFIED
  • Package Shape:RECTANGULAR
  • Package Style:FLANGE MOUNT
  • Reflow Temperature-Max (s):NOT SPECIFIED
  • Package:Bulk
  • Base Product Number:BR1002
  • Mfr:Comchip Technology
  • Product Status:Obsolete
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Series:-
  • Additional Feature:UL RECOGNIZED
  • Technology:Standard
  • Terminal Position:UPPER
  • Terminal Form:SOLDER LUG
  • Peak Reflow Temperature (Cel):NOT SPECIFIED
  • Reach Compliance Code:compliant
  • Time@Peak Reflow Temperature-Max (s):NOT SPECIFIED
  • JESD-30 Code:R-XUFM-D4
  • Configuration:BRIDGE, 4 ELEMENTS
  • Diode Type:BRIDGE RECTIFIER DIODE
  • Current - Reverse Leakage @ Vr:10 µA @ 200 V
  • Voltage - Forward (Vf) (Max) @ If:1.1 V @ 5 A
  • Case Connection:ISOLATED
  • Output Current-Max:10 A
  • Current - Average Rectified (Io):10 A
  • Number of Phases:1
  • Rep Pk Reverse Voltage-Max:200 V
  • Non-rep Pk Forward Current-Max:240 A
  • Voltage - Peak Reverse (Max):200 V

在庫數 0

小計金額 $0.00000