Home Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) XC3SD3400A-4FG676I.5C
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XC3SD3400A-4FG676I.5C
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Xilinx
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Embedded - FPGAs (Field Programmable Gate Array)
- Field-Programmable Gate Array
Date Sheet
在庫數 0
小計金額 $0.00000
仕様 よくある質問
- Mounting Type:Through Hole
- Contact Shape:Circular
- Voltage, Rating:800V
- Package:Tube
- Base Product Number:M80-753
- Mated Stacking Heights:7.23mm, 7.85mm, 10.2mm, 13.51mm
- Mfr:Harwin Inc.
- Product Status:Active
- Contact Materials:Phosphor Bronze
- Contact Finish Mating:Gold
- Insulation Materials:Polyphenylene Sulfide (PPS), Glass Filled
- Contact Length-Mating:-
- Operating Temperature:-55°C ~ 125°C
- Series:Datamate L-Tek
- Termination:Solder
- Connector Type:Header
- Number of Positions:34
- Applications:-
- Number of Rows:2
- Fastening Type:Latch Lock
- Contact Type:Male Pin
- Current Rating (Amps):2.2A per Contact
- Ingress Protection:-
- Insulation Height:0.219 (5.56mm)
- Style:Board to Board or Cable
- Number of Positions Loaded:All
- Pitch - Mating:0.079 (2.00mm)
- Insulation Color:Black
- Row Spacing - Mating:0.079 (2.00mm)
- Contact Length - Post:0.177 (4.50mm)
- Shrouding:Shrouded - 4 Wall
- Contact Finish - Post:-
- Overall Contact Length:-
- Features:-
- Contact Finish Thickness - Mating:29.5µin (0.75µm)
- Contact Finish Thickness - Post:-
- Material Flammability Rating:UL94 V-0
在庫數 0
小計金額 $0.00000











